Chiplet-based compute architectures for vehicles are entering a new phase, reshaping SDV hardware roadmaps by enabling modular multi-die platforms that scale performance, improve yield, and accelerate refresh cycles while meeting long lifecycles, safety, and cybersecurity requirements. This Frost & Sullivan analysis examines how automakers, Tier 1s, silicon vendors, foundries/outsourced semiconductor assembly and tests (OSATs), substrate and IP providers are converging to reduce cost and time-to-market while strengthening compliance and supply resilience. With rising emphasis on reuse and upgradability, chiplets move beyond first-wave advanced driver assistance systems (ADAS) into central compute, zonal/body controllers, infotainment, connectivity/telematics, powertrain inverters, and sensor hubs. The analysis explores key megatrends, including centralized/zonal E/E migration, die-to-die interconnect standardization, packaging choices, safety/cyber workflows, KGD and D2D test (BIST/DFT), and lifecycle and over-the-air implications for multi-die electronic control units (ECUs).

• How can you benefit from a comparative benchmarking of leading ecosystems and suppliers across compute, packaging/test, substrates, and IPs?
• In what ways can you optimize growth strategies based on partner selection criteria, packaging/test guardrails, governance checklists, and actionable recommendations for OEMs, Tier 1s, and technology providers?
• How can your organization identify near-term growth opportunities like multi-chiplet central compute, ADAS/AI accelerators, zonal I/O and security chiplets, auto-grade D2D test and KGD services, and chiplet-to-cloud lifecycle management?