The semiconductor industry is approaching the physical and economic limits of traditional lithography, driving the emergence of next-generation patterning technologies essential for scaling beyond 3 nm and into the sub-2 nm era. This analysis explores the technological evolution, ecosystem enablers, and strategic implications of next-gen lithography, including high-NA EUV (numerical aperture extreme ultraviolet), multiple e-beam, nanoimprint, and soft X-ray lithography.

It examines how advancements in resists, pellicles, photomasks, metrology, and computational lithography are enabling unprecedented precision and yield improvements for logic, memory, and heterogeneous integration applications. The analysis highlights recent deployments by leading foundries and toolmakers, including ASML, Zeiss, TSMC, Intel, and EVG, and analyzes the patent landscape shaping future innovation.

•    What are the key growth avenues in high-NA EUV for sub-2 nm nodes, soft X-ray lithography (beyond EUV), and AI-integrated digital twin solutions for process optimization?
•    How can foundries, policymakers, and ecosystem partners gain strategic recommendations to achieve massive growth? 
•    Which growth opportunities can help you secure technological leadership and manage high capital risks?